Batch Processes
Batch Wet Processing for Semiconductor Cleaning and Wet and Dry Etching
Batch wet processing is applied in semiconductor manufacturing and pilot environments for cleaning and wet etching steps where throughput and operational efficiency are primary drivers. By processing multiple wafers simultaneously, batch systems support stable, repeatable execution of well-defined process steps.
MDC Europe provides batch wet processing solutions configured for safe chemical handling, process consistency and integration into industrial and pilot workflows.
Process Context for Batch Wet Processing
Batch processing is typically used when:
- process recipes are mature and stable
- uniform treatment across multiple wafers is acceptable
- throughput and cost efficiency are key priorities
- individual wafer-level control is not required
This approach is common in established front-end and back-end process steps.
Typical Batch Wet Processing Applications
- Wafer cleaning and surface preparation
- Wet etching of silicon and dielectric materials
- Photoresist residue removal
- Front-end and back-end semiconductor processing
Different processing modules
- High throughput wet processing
- Up to 300 mm
- Up to 100 wafer per run
- Dry in Dry out
- NID for IPA drying in combination with N2
- Electroless metallization with nickel, palladium and gold
MDC Europe Expertise in Wet Processing
With experience across both batch and single wafer technologies, MDC Europe delivers wet processing solutions adapted to research, pilot and manufacturing environments. Our teams support system definition, configuration and long-term operation.
Why to Choose Our Products?
- OEM-level refurbishment meeting original specifications
- 30+ years of experience in semiconductor solutions
- Fast European delivery and support
- Comprehensive product portfolio from spares to systems
- Trusted by leading OEMs and research institutes