Contactless Resistivity Measurement

Contactless Resistivity Measurement provides integrated resistivity characterization within automated metrology platforms, supporting high throughput evaluation of semiconductor materials and devices. These modules enable seamless integration into advanced characterization workflows, reducing manual intervention while maintaining measurement accuracy and repeatability.

MDC Europe provide fast, accurate, and non-destructive measurements of sheet resistance, resistivity, thickness, and conductivity across a wide range of materials including wafers, films, glass, and flexible circuits. With its intuitive software, one-button operation, and scalability through additional sensors and ranges, it offers real-time process control and precision that reduces product and labor costs while ensuring consistent quality.

Measurement Technology

Non-contact and non-destructive measurement enables accurate evaluation of sheet resistance, resistivity, thickness, and emissivity without physically touching the sample, preserving sensitive surfaces and delicate structures.
The technology supports a wide range of applications and materials, including wafers, glass substrates, thin films, coatings, flexible circuits, batteries, photovoltaic devices, smart glass, and more.
It delivers fast and precise measurements with nearly instantaneous readings and up to 99.9% accuracy, fully calibrated to NIST standards for reliable and traceable results.
Designed for flexibility and scalability, the system can be easily upgraded with additional sensors, measurement ranges, or positioning stages to accommodate evolving process requirements.
User-friendly operation is ensured through a one-button LCD interface, intuitive software environment, and seamless integration with Python libraries for advanced automation and data analysis.
Real-time process control capabilities allow users to continuously monitor, map, and inspect materials in order to detect coating defects early and reduce production costs.
Its compact design supports spot sizes starting from 26 mm and can be combined with a 200 mm x 200 mm stage for both benchtop and inline metrology applications.

Functional Capabilities

Integration with automated characterization platforms
Consistent contact and measurement sequencing
Support for standard wafer diameters and process monitoring

MDC Europe Integration Support

MDC Europe provides support for system definition, integration planning and qualification to ensure sheet resistance modules perform within automated metrology frameworks.

Why to Choose Our Products?

OEM-level refurbishment meeting original specifications
30+ years of experience in semiconductor solutions
Fast European delivery and support
Comprehensive product portfolio from spares to systems
Trusted by leading OEMs and research institutes