Probe Tips

Probe Tips for Four-Point Probe, CV/IV and Parametric Test Systems

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Probe tips are consumable contacts used in four-point probe, resistivity measurement, CV/IV and parametric test systems. Tip material and geometry directly affect contact quality, measurement accuracy and wafer surface integrity.

MDC Europe supplies a range of probe tips in multiple materials and geometries, configured for standard probe holders and semiconductor measurement platforms. Tips are supplied 5 per box. All probes have a shaft diameter of 0.020″ to 0.025″ and fit standard probe holders, except Model 896-PRB-01 which requires a special retractable holder.

Probe Tip Selection Criteria

Probe tips are selected based on:

  • contact material and tip radius suited to the wafer surface
  • current requirements and contact resistance constraints
  • compatibility with the probe holder and measurement system

Probe Tips Portfolio

MDC Europe provides probe tips including:

  • PSE-T — Tungsten, standard general purpose, 5 µm tip
  • PSE-GA — Flexible tungsten, 0.5 µm tip radius, contact retention
  • PSE-TB — Tungsten blunt, general purpose, 25 µm tip
  • PSE-O — Osmium, low contact resistance, 12 µm tip radius
  • PSE-S — Steel, very hard, poly contact
  • PSE-TC — Tungsten carbide, very hard, 10 µm tip radius
  • PSE-P — Palladium, low contact resistance
  • PSE-CW — Tungsten “cat whisker”, clean metal contact only
  • PSE-BC — Beryllium copper, high current, 12 µm tip radius
  • 896-PRB-01 — Tungsten retractable, spring-loaded, 0.002″ diameter tip

MDC Europe Capability

MDC Europe supports probe tip selection aligned with measurement platform requirements, ensuring contact compatibility and measurement repeatability across resistivity, CV/IV and parametric test applications.

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Why to Choose Our Products?

  • OEM-level refurbishment meeting original specifications
  • 30+ years of experience in semiconductor solutions
  • Fast European delivery and support
  • Comprehensive product portfolio from spares to systems
  • Trusted by leading OEMs and research institutes